We conduct a series of functional tests and environmental stress screening (ESS) as part of our PCB assembly and rework services. To screen out design faults and defective assemblies, we perform ESS during assembly development as well as manufacturing. Functional testing, including thermal cycling and vibration testing, is carried out prior to, during, and after ESS processes to verify design tolerances. An inventory of automated optical and 3D X-ray inspection equipment is maintained to check component placement, alignment, plus soldering in assemblies.
Our ESS process applies a wide range of stresses, including thermal shock, temperature, and vibration to evaluate product reliability in an assembly. The test results indicate the susceptible points in a system and help in improving the product design. A complete report is generated, which contains the failures identified, their root cause, and corrective actions to prevent re-occurrence.